Description
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Categories
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Connectors, Interconnects
|
|
Sockets for ICs, Transistors
|
|
| Manufacturer | Samtec Inc. |
| Series | iCF |
| Packaging |
Tape & Reel (TR)
|
| Part Status | Active |
| Type |
DIP, 0.3″ (7.62mm) Row Spacing
|
| Number of Positions or Pins (Grid) | 14 (2 x 7) |
| Pitch – Mating | 0.100″ (2.54mm) |
| Contact Finish – Mating | Tin |
| Contact Finish Thickness – Mating | – |
| Contact Material – Mating |
Beryllium Copper
|
| Mounting Type | Surface Mount |
| Features | Open Frame |
| Termination | Solder |
| Pitch – Post | 0.100″ (2.54mm) |
| Contact Finish – Post | Tin |
| Contact Finish Thickness – Post | – |
| Contact Material – Post |
Beryllium Copper
|
| Housing Material |
Liquid Crystal Polymer (LCP)
|
| Operating Temperature | -55°C ~ 125°C |
| Termination Post Length | – |
| Material Flammability Rating | – |
| Contact Resistance | – |
